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Taking a peek beneath the motherboard, we make a couple cool observations.
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That massive copper heat pipe under the board is much beefier than the one in the S9—it looks more like the one we found in the Note9.
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Meanwhile, we peel off an additional, multi-layer piece of thermal interface material from the board. All that copper makes a great, big, flat surface, for better thermal transfer—but it's soft metal, so you need this soft interface to fill in any gaps that might otherwise kill performance or overheat your phone.
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This thin sticker also seems to provide some RF shielding, as there's a big hole in the can lid underneath—where we find a PMIC and a big pink thermal pad.
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TL;DR: We surmise that fast charging + reverse wireless charging puts some serious thermal stress on the electronics in this system. Samsung has pulled out all the stops to cool it off.
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