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Vue éclatée du HomePod

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HomePod Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 HomePod Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 HomePod Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.

  • Chipwise, we spy:

  • Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)

  • Toshiba THGBX4G7D2LLDYC 16 GB NAND flash

  • USI 339S00450 WiFi/Bluetooth module, likely with a Broadcom BCM43572 trapped inside

  • Apple/Dialog Semiconductor 338S00100-AZ PMIC

  • Interestingly, the reverse has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

Nous extrayons le prochain disque, celui qui abrite le raffiné système de fixation du cordon ainsi que la carte mère principale, juste derrière.

Parmi les puces, nous sommes ravis de vous présenter :

Système sur une puce (SoC) Apple A8 APL1011 SoC (nous l'avons déjà rencontrée quelque part, mais elle exerçait une autre fonction), vraisemblablement combinée avec 1 Go de RAM posée en dessous

Mémoire flash NAND de 16 Go THGBX4G7D2LLDYC Toshiba

Module Wi-Fi/Bluetooth 339S00450 USI, dissimulant certainement une puce BCM43572 Broadcom à l'intérieur

CI de gestion d'alimentation 338S00100-AZ Apple/Dialog

Curieusement, le verso ne montre que quelques socles SMD pour quelques puces et plusieurs éléments passifs. La conception du HomePod aurait-elle subi quelques changements de dernière minute ?

[* black] The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.
[* black] Chipwise, we spy:
- [* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM layered underneath
+ [* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)
[* orange] Toshiba THGBX4G7D2LLDYC 16 GB NAND flash
[* yellow] USI 339S00450 WiFi/Bluetooth module, likely with a [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|Broadcom BCM43572 trapped inside|new_window=true]
- [* green] Apple/Dialog [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
+ [* green] Apple/Dialog Semiconductor [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
[* black] Interestingly, [https://d3nevzfk7ii3be.cloudfront.net/igi/UYNZVyo2AiAL1djs|the reverse|new_window=true] has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

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