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Samsung Galaxy S8+ Teardown

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We push the cameras off to the side in order to pore over this motherboard's silicon. Our findings include:

Samsung K3UH5H50MM-NGCJ 4 GB LPDDR4 RAM layered over the MSM8998 Snapdragon 835

Toshiba THGAF4G9N4LBAIR 64 GB UFS (NAND flash + controller)

Qualcomm Aqstic WCD9341 audio codec

Skyworks SKY78160-11 front-end module w/ LNA

Avago AFEM-9066 front-end module

Qualcomm QET4100 envelope tracker

Silicon Mitus SM5720 Interface PMIC

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