The back plate is very fragile in some areas, so be careful when prying. These areas are the SIM slot, power and volume buttons, headphone jack, and camera bezel.

Insert a shimmy tool in the SIM slot, into the edge of the plate, to create a gap. Then, insert a pick into the gap, and slide it across the edge of the phone, to unclip the plate.

Do not try to unclip the part around the camera. We will save that for step 4.