Next, remove the chip on the original screen with the same method.

Clean tin on the chip of the original screen. Apply some middle-temperature Solder Paste to the bonding pads. Clean tin and black adhesive on the bonding pads of the chip with Solder Wick. Keep cleaning the bonding pads with PCB Cleaner.

Next, reball the chip. Put the reballing stencil in position. Apply a layer of middle-temperature Solder Paste evenly.