Tips: since components around are close to PMU we need to be careful when removing black adhesive to avoid knocking components off the board.

Continue to heat up PMU with Hot Air Gun at 330℃, air flow 5. Also when heating, get one lever of the tweezers fixed first. 15s later, as solder starts to melt, pry up the chip quickly with the other lever. Tips: make sure you pry up the chip at the right time. Otherwise, the bonding pad might get damaged.