Once finished, click ‘Query Info’. Basic info of the new chip will be displayed on the interface. Once done, take out the new NAND Flash chip. Now we need to get the new NAND flash chip reballed. Get the BGA Reballing Stencil in position. Smear medium-temp solder paste evenly on the stencil.

Heat with Hot Air Gun at 300℃, air flow 3 So that all solder balls can shape up completely. Once completed, wait for 1 minute

Then separate the NAND flash chip from the stencil. Heat again to ensure the formation of solder balls. Let’s move on to NAND soldering. Before soldering, apply some medium-temp solder paste to the bonding pad with Soldering Iron at 365℃.

Clean the bonding pad afterwards. Then clean thoroughly with Solder Wick and clean with PCB Cleaner afterwards.