Apply some Solder Paste to the missing pads and apply tin with Hot Air Gun at 340 °C. Clean the bonding pad with PCB Cleaner and apply some Paste Flux.

Solder 0.02 mm copper wires to the bonding pad with Soldering Iron. Please be noted that copper wires must be soldered firmly.

Clean with PCB Cleaner again and curl the copper wires to make pads with Tweezers and Sculpture Knife.