Next, we will share another recombination method. The method can be taken if the middle bonding pad is not damaged.

When the tin melts, remove the logic board in a vertical manner with tweezers. It can be seen that there is a metal pad of 0.05 mm thickness around the signal board at a certain distance. This metal pad is designed to keep a 0.05 mm gap between the logic board and the middle layer, preventing the solder balls from bridging while soldering.

You only need to remove thermal grease on the motherboard when the repair is done. Keep original tin on the bonding pad and apply a small amount of Paste Flux.

Lastly, align the logic board with the signal board. When the temperature reaches 165 °C and the tin melts, turn the power off. Press two ends of the logic board with tweezers until the motherboard has cooled. The logic board and the signal board fit closely in this way. There will be no bridging and solder balls spillover.