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Microsoft Surface Duo Teardown

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And now for the main event, chips! A lot of this is last year's silicon, but that doesn't mean it's not worth stopping to catalog:

Qualcomm Snapdragon 855, layered under 6 GB of SK hynix DRAM

128 GB Toshiba UFS 3.0 storage

Qorvo 78052 RF Fusion MHB front-end module

Microsoft X904163 display driver

Qualcomm SDR8150 LTE Transceiver

Qualcomm WCD9340 audio codec

Qualcomm PM8150 power management ICs

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