crwdns2933803:010crwdne2933803:0
crwdns2933797:0Brittany McCriglercrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Brittany McCrigler
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| [* black] the s1! | |
| [* black] and some closeups, if we have anything to say about those? | |
| + | [* black] Most of the S1 is wire bonding onto the board from flexible circuit—which is why they encapsulated it in resin—no solder, minimal stability. |
| + | [* black] Wire bonds are typically 10-17 microns, very small, very fragile. |
| + | [* black] This saves space, as soldered packages will be thicker, but requires a whole new type of manufacturing. |