crwdns2933803:07crwdne2933803:0
crwdns2933797:0CChincrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Sam Omiotek
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| [* black] The Flip packs a dense, double-stacked motherboard—known in the industry as a [https://www.quick-pcba.com/pcb-news/substrate-like-pcb-technology.html|substrate-like PCB|new_window=true]. We first saw this space-saving technology in the [guide|98975|iPhone X|stepid=182892|new_window=true], and more recently in the [guide|125590|Note10|stepid=242798|new_window=true]. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space: | |
| - | [* red] Samsung |
| - | [* orange] Samsung |
| + | [* red] Samsung [link|https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM-AGCL] 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU |
| + | [* orange] Samsung KLUEG8UHDB-C2D1 UFS 3.1 256 GB NAND Flash |
| [* yellow] Broadcom AFEM-9106 front-end module | |
| - | [* green] Skyworks |
| + | [* green] Skyworks [link|https://store.skyworksinc.com/products/detail/sky7816051-skyworks/625141/|SKY78160-51] Low Noise Amplifier |
| [* light_blue] Qualcomm SDR8150 RF transceiver | |
| - | [* blue] Qualcomm WCN3998 WiFi + Bluetooth SoC |
| - | [* violet] NXP |
| + | [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2018/02/21/qualcomm-introduces-industrys-first-integrated-80211ax-ready-solution|WCN3998] WiFi + Bluetooth SoC |
| + | [* violet] NXP Semiconductor [link|https://media.nxp.com/news-releases/news-release-details/nxp-and-garmin-team-bring-secure-and-convenient-nfc-mobile|PN80T] NFC controller w/ Secure Element |