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Repair information, troubleshooting tips, and guides for the sixth iteration of Apple iPhone, announced on September 12, 2012. Model: A1428, A1429

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cause of cracked components on board

Hi, I purchased a dead iphone 5 logic board from ebay to practice on before attempting to repair a black screen on another ebay purchase. After removing the shields and taking a look at the components that were under it, a number of them have physical damage. As I have no history on the board, this is either due to what happened to it before I started on it - or from the shield removal. The shields were removed with hot air at 450c and came off with no apparent problems in less than 60 seconds. There were a couple of cracking noises during the removal but according to a youtube demo I had watched, this is a normal sound as the shields separate.

Can the heat of shield removal do this or is that just not how it works, so it will more likely be damage from prior. Before starting on the other board, I really want to understand this.

Please refer to the attached photos.

Thx

Paul

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To begin with, 450c may be too much.

These are inductors. It looks like the covers are damaged either by force, intense heat or improper separation when pulling off the shield. It is likely that excess underfill glued the covers to the shield and when you take it off, they are pulled off together.

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This is caused by a malfunctioning cmos in the ram. Open up the ram bezel, remove the ram by pushing both metal ram locks up and towards each other and remove the ram. Lightly apply some wd-40 on both ram slots and on the gold puns on the ram cards, then reinsert the ram.

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I think that your answer may have been meant for a different question.

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@sherrytech you are way off on this one. RAM removal? Ram slots? Revew your answer. This is a phone not a computer.

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Is it ifixit's answer server bug or you actually posted the wrong answer?

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This isn't the first time this has happened with this person... Look at their other answers.

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