From the images Samsung offers looks like there is four screws which hold the heatsink package together besides the TIM material covering the chips. But to release the grip of the TIM you will need to spin the bottom plate and heatsink slightly along the surface which you can’t do here as the heatsink bottom plate has four fold over tabs that block it. To add to that prying will over stress the ball pads securing the chips to the PCB base.
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So the bottom line here is the chance of success is very low and just like a raw egg broken in your hands offers no meal. Even if it was a good deal.
Sometimes the risks outweigh the reward!
From the images Samsung offers looks like there is four screws which hold the heatsink package together besides the TIM material covering the chips. But to release the grip of the TIM you will need to spin the bottom plate and heatsink slightly along the surface which you can’t do here as the heatsink bottom plate has four fold over tabs that block it. To add to that prying will over stress the ball pads securing the chips to the PCB base.
So the bottom line here is the chance of success is very low and just like a raw egg broken in your hands offers no meal. Even if it was a good deal.