@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why (different device, same idea)[http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
+
@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why (different device, same idea) [http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
[image|765994]
+
It is the constant heating and cooling of the die to the substrate that causes a failure of the "bumps" As you can see the "bumps" are what actually connects the die to the substrate to make the chip complete. If these bumps fail, the die does no longer make contact with the substrate and thus no contact with the circuit board.
[image|1216980]
The chip has failed.
the baking of the board or a reflow/reball may only work for a bit. iFixit.org had a pretty good article written about the baking and additional copper shims [https://ifixit.org/blog/6882/why-i-drilled-holes-in-my-macbook-pro-and-put-it-in-the-oven/|on here.]
Again, this is only a supplement to what experts like @mayer are already suggesting.
@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why (different device, same idea)[http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
[image|765994]
-
-
As you can see the "bumps" are what actually connects the die to the substrate to make the chip complete. If these bumps fail, the die does no longer make contact with the substrate and thus no contact with the circuit board.
+
It is the constant heating and cooling of the die to the substrate that causes a failure of the "bumps" As you can see the "bumps" are what actually connects the die to the substrate to make the chip complete. If these bumps fail, the die does no longer make contact with the substrate and thus no contact with the circuit board.
[image|1216980]
The chip has failed.
the baking of the board or a reflow/reball may only work for a bit. iFixit.org had a pretty good article written about the baking and additional copper shims [https://ifixit.org/blog/6882/why-i-drilled-holes-in-my-macbook-pro-and-put-it-in-the-oven/|on here.]
Again, this is only a supplement to what experts like @mayer are already suggesting.
@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why (different device,
-
same idea)[http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
+
@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why (different device, same idea)[http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
[image|765994]
As you can see the "bumps" are what actually connects the die to the substrate to make the chip complete. If these bumps fail, the die does no longer make contact with the substrate and thus no contact with the circuit board.
[image|1216980]
The chip has failed.
the baking of the board or a reflow/reball may only work for a bit. iFixit.org had a pretty good article written about the baking and additional copper shims [https://ifixit.org/blog/6882/why-i-drilled-holes-in-my-macbook-pro-and-put-it-in-the-oven/|on here.]
Again, this is only a supplement to what experts like @mayer are already suggesting.
@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why [ http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
+
@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why (different device,
+
same idea)[http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
[image|765994]
As you can see the "bumps" are what actually connects the die to the substrate to make the chip complete. If these bumps fail, the die does no longer make contact with the substrate and thus no contact with the circuit board.
[image|1216980]
The chip has failed.
the baking of the board or a reflow/reball may only work for a bit. iFixit.org had a pretty good article written about the baking and additional copper shims [https://ifixit.org/blog/6882/why-i-drilled-holes-in-my-macbook-pro-and-put-it-in-the-oven/|on here.]
Again, this is only a supplement to what experts like @mayer are already suggesting.
@skybar this is just a supplement. You are having this issue because of the actual chip design. Only seldom is it a failure of the solder balls which connect the IC BGA package to the motherboard. It does happen and you can see why [ http://www.bunniestudios.com/blog/?p=223|on here] More commonly however is that the failure is due to the chip design itself.
[image|765994]
As you can see the "bumps" are what actually connects the die to the substrate to make the chip complete. If these bumps fail, the die does no longer make contact with the substrate and thus no contact with the circuit board.
[image|1216980]
The chip has failed.
the baking of the board or a reflow/reball may only work for a bit. iFixit.org had a pretty good article written about the baking and additional copper shims [https://ifixit.org/blog/6882/why-i-drilled-holes-in-my-macbook-pro-and-put-it-in-the-oven/|on here.]
Again, this is only a supplement to what experts like @mayer are already suggesting.