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VIA GO Teardown

crwdns2935163:0crwdne2935163:0 Artur Huhtaniemi (crwdns2935085:0crwdne2935085:0)
crwdns2935165:0February 2, 2025crwdne2935165:0
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VIA GO Teardown

crwdns2935163:0crwdne2935163:0 Artur Huhtaniemi (crwdns2935085:0crwdne2935085:0)
crwdns2935165:0February 2, 2025crwdne2935165:0
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Explore internals of the device: layout, components and upgradability.

GIGABYTE VIA-GO motherboard, model MZBSWOP-W1

Intel Celeron N3010 (cpuid 406C4)

LPDDR3 1.35V SODIMM

integrated eMMC (SD) Kingston M52532 1AED76C6 32Gb

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  1. VIA GO Teardown, Overview: crwdns2935265:01crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, Overview: crwdns2935265:01crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, Overview: crwdns2935265:01crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

    • USB and audio ports at front and rest of I/O are at the back. power button is on top.

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  2. VIA GO Teardown, bottom screws: crwdns2935265:02crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

    • Remove four (phillips) screws on the bottom of the device, these are located inside of rubber feet.

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  4. VIA GO Teardown, motherboard: crwdns2935265:03crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, motherboard: crwdns2935265:03crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, motherboard: crwdns2935265:03crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

    • remove screws that hold motherboard in the case.

    • LPDDR3 slot (there is no internal memory).

    • M.2 slot with Intel 3160NGW (Dual-band AC-WiFi + BT)

    • 20-pin connector for external SATA hard drive.

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  5. VIA GO Teardown, CPU and heatsink: crwdns2935265:04crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, CPU and heatsink: crwdns2935265:04crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, CPU and heatsink: crwdns2935265:04crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

    • screws to remove fan assembly

    • screws to remove heatsink

    • RTC battery

    • eMMC (SD) chip

    • power button

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  6. VIA GO Teardown, CPU without heatsink: crwdns2935265:05crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 VIA GO Teardown, CPU without heatsink: crwdns2935265:05crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

    • closeup of Intel N3010 SoC and eMMC chip.

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  7. VIA GO Teardown, motherboard (without memory): crwdns2935265:06crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, motherboard (without memory): crwdns2935265:06crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 VIA GO Teardown, motherboard (without memory): crwdns2935265:06crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

    • component overview. also closeup of 20-pin external sata connector.

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Artur Huhtaniemi

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