Found this phone lying around, so decided to make a teardown of it!

First, remove the backplate by pushing the button at the top of the back of the phone.

From here there are six screws we have to remove.

Get a thin opening tool and slide it around the bezel of the device.

The front and back of the device should separate.

Two buttons should come off after you have removed the back.

This is the rear speaker.

Both of these buttons need to be pried from the front casing to allow the mainboard to come away from the front housing.

The front speaker also has to be pried from the front housing.

The main board can then be lifted from the front housing.

The buttons on the front housing can then be pushed out through the back of the housing.

The EMI shield can be removed by unclipping the clips on the side of the device.

In the centre of the picture is the vibration module. It can be unclipped to remove it.

The LCD ribbon cable and connector are under a plastic sheet that has to be removed.

The ribbon cable can then be take out of the connector

Use a thin opening tool to separate the LCD from the main board.

Chip inspection time!

Mediatek ARM MT6A01AA

Samsung K5D1H12ACC-A075 NAND flash memory

Skyworks Solutions SKY77524-15

CSR 51E130A14U