crwdns2934019:0PlayStation 5 Teardowncrwdne2934019:0
ZHcrwdns2931649:0#15crwdne2931649:0 [crwdns2931437:0crwdne2931437:0]
crwdns2934003:0crwdnd2934003:0TheElderFrogcrwdnd2934003:01crwdne2934003:0
(crwdns2942739:0crwdne2942739:0)
crwdns2933983:0crwdne2933983:0
| 0-black-Next up, out come the guts: button sensors, motherboard, haptic drivers, and adaptive triggers, all mounted to a black midframe. | |
| 1-icon_note-From this perspective, it's pretty clear how much faith Sony has in the DualSense's fancy upgrades. Half of the internal volume is dedicated to the triggers and haptics! | |
| 0-black-Both adaptive trigger assemblies connect with cables, but the haptic drivers, USB-C port, and joysticks are all held down by soldered connections. | |
| 0-black-On the backside lives the main circuit board. And where there's a circuit board, there are chips: | |
| 1-red-SIE CXD9006GG — Likely a custom Sony chip doing all the grunt work | |
| 1-orange-Dialog DA9087 PMIC | |
| 1-yellow-Realtek ALC5524 audio codec | |
| 1-green-Nuvoton NAU8225 3.0 W Class-D Audio Amplifier |
| - | [* black] 接下来， |
|---|---|
| + | [* black] 接下来，内部一览无余：按钮传感器，主板，触觉驱动器和自适应扳机都安装在黑色中框上。 |
| [* icon_note] 从这个角度来看，很明显，索尼对DualSense的高级升级有多大的信心。内部音量的一半专用于触发器和触觉！ | |
| [* black] 两个自适应触发器组件均通过电缆连接，但触觉驱动器，USB-C端口和操纵杆均通过焊接连接压紧。 | |
| [* black] 主电路板位于背面。在有电路板的地方，有芯片： | |
| [* red] SIE CXD9006GG —可能是定制的索尼芯片，可以完成所有艰苦的工作 | |
| [* orange] 对话框DA9087 PMIC | |
| [* yellow] Realtek ALC5524音频编解码器 | |
| [* green] 新唐NAU8225 3.0 W D类音频放大器 |