We’re in the 11th hour of teardowns, literally. We’re very sleepy, so we’ll skip the song and dance and just tell you what’s inside the iPhone 6s Plus. Drumroll please…
• The display assembly on the 6s Plus weighs in at 80 g—while on last year’s 6 Plus, it weighed a measly 60 g. This astonishing 33% increase in weight is all because of Apple’s new 3D Touch technology. That’s some heavy stuff.
• The battery capacity sits at 2750 mAh; a modest 165 mAh downgrade compared to last year’s 6 Plus. Despite the downgrade, Apple claims battery life will be comparable to that of the 6 Plus.
• The iPhone 6s Plus—like its iPhone 6s brethren—inherits a 7 out of 10 on the Repairability scale.
- iPhone 6s Plus Chips:
 • Apple A9 APL1022 SoC + SK Hynix LPDDR4 RAM
 • Qualcomm MDM9635M LTE Cat. 6 Modem
 • TriQuint TQF6405 Power Amplifier Module
 • Skyworks SKY77812 Power Amplifer Module
 • TriQuint TQF6405 Power Amplifier Module
 • Skyworks SKY77812 Power Amplifer Module
 • Avago AFEM-8030 Power Amplifier Module
 • Qualcomm QFE1000 Envelope Tracking IC
 • SK Hynix H230DG8UD1ACS 16 GB NAND Flash
 • Universal Scientific Industrial 339S00043 Wi-Fi Module
 • NXP 66V10 NFC Controller
 • Apple/Dialog 338S00122 Power Management IC
 • Apple/Cirrus Logic 338S00105 Audio IC
 • Qualcomm PMD9635 Power Management IC
 • Skyworks SKY77357 Power Amplifier Module
 • Murata 240 Front-End Module
 • RF Micro Devices RF5150 Antenna Switch
 • NXP 1610A3
 • Apple/Cirrus Logic 338S1285 Audio IC
 • Texas Instruments 65730AOP Power Management IC
 • Qualcomm WTR3925 Radio Frequency Transceiver
 • Skyworks SKY13701 WLAN Front-End Module
 • Texas Instruments TI 57A5KXI
These are just the teardown highlights. You can catch our full analysis at the teardown.
 
               
               
               
            
      
      
   
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