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iPhone X 拆解

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iPhone X Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone X Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone X Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course.

  • The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers.

  • With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.

  • The iPhone X logic board is the first double-stacked board we've seen in an iPhone since the very first iPhone (third photo).

  • The downside of this clever design is that many board-level repairs will be a lot more difficult.

苹果是靠什么技术在原有面积70%的地方上加入更多的技术呢?那就是将一块主板对折

两块单独主板焊接在了一起,所以我们从我们的伙伴Circuitwise那儿借到了BGA工作台以分离两层主板

将两层主板分离后,我们计算了单个主板的面积并累加在一起,发现iPhone X的主板总面积是iPhone 8 Plus主板的135%,这就是苹果以退为进的办法

iPhone X的主板是我们从第一代iPhone以来看到的第一个双层主板(第三张照片)

这个聪明的设计所带来的缺点是许多主板级维修将会变得更困难

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