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Smontaggio iPhone 8 Plus

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iPhone 8 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 8 Plus Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • IC Identification, pt. 3:

  • Bosch Sensortec accelerometer/gyroscope

  • Bosch Sensortec BMPxxx ? pressure sensor

  • Nexperia (formerly NXP Semiconductor) 74LVC1G3157-Q100 2-ch. analog multiplexer/demultiplexer

  • Texas Instruments DRV8833 H-bridge motor driver (likely)

  • SiTime SiTxxxx MEMS oscillator

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+[* black] IC Identification, pt. 3:
+ [* red] Bosch Sensortec accelerometer/gyroscope
+ [* orange] Bosch Sensortec BMPxxx ? pressure sensor
+ [* yellow] Nexperia (formerly NXP Semiconductor) [link|https://www.nexperia.com/products/analog-logic-ics/automotive-logic/switches-multiplexers-de-multiplexers/series/74LVC1G3157-Q100.html|74LVC1G3157-Q100] 2-ch. analog multiplexer/demultiplexer
+ [* green] Texas Instruments [link|https://www.ti.com/product/DRV8833|DRV8833] H-bridge motor driver (likely)
+ [* light_blue] SiTime SiTxxxx MEMS oscillator

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