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iPhone 8 Plus Teardown

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iPhone 8 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 8 Plus Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Let's take a look at what the iPhone 8 Plus has under the hood:

  • Apple 339S00439 A11 Bionic SoC layered over Samsung 3 GB LPDDR4 RAM

  • Qualcomm MDM9655 Snapdragon X16 LTE modem

  • Skyworks SkyOne SKY78140

  • Avago 8072JD112

  • P215 730N71T - likely an envelope tracking IC

  • Skyworks SKY77366-17 quad-band GSM power amplifier module

  • NXP Semiconductor 80V18 (PN80V) secure NFC module

Lass uns nachsehen, was das iPhone 8 Plus unter der Haube hat:

Apple 339S00439 A11 Bionic SoC über einem Samsung 3 GB LPDDR4 RAM

Qualcomm MDM9655 Snapdragon X16 LTE Modem

Skyworks SkyOne SKY78140

Avago 8072JD112

P215 730N71T – wahrscheinlich eine Envelope Tracking IC

Skyworks Sky 77366-17 Quadband-GSM-Leistungsverstärkermodul

NXP Semiconductor 80V18 (PN80V) sicheres NFC-Modul

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