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Qualcomm released a development kit for the Snapdragon 835 showing us some silicon to expect. The chips we find are:
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Samsung KLUDG8V1EE-B0C1 128GB UFS
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Qualcomm PMI8998 PMIC
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Samsung K3UH5H50MM-NGCJ 4 GB LPDDR4 mobile DRAM
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Qualcomm WTR5975 gigabit LTE transceiver
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Qualcomm WCN3990 2x2 802.11ac Wi-Fi with MU-MIMO companion
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Qualcomm WCD9335 audio codec (likely similar to the WCD9311)
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2x Qorvo QM48859 RF Fusion iFEM module
| [* black] Qualcomm released [https://developer.qualcomm.com/download/sd835-hdk/sd835-hdk-product-brief.pdf|a development kit for the Snapdragon 835|new_window=true] showing us some silicon to expect. The chips we find are: | |
| [* red] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUDG8V1EE-B0C1?ia=2413|KLUDG8V1EE-B0C1|new_window=true] 128GB UFS | |
| [* orange] Qualcomm PMI8998 PMIC | |
| [* yellow] Samsung [http://www.samsung.com/semiconductor/products/dram/mobile-dram/low-power-ddr4x/K3UH5H50MM-NGCJ?ia=3157|K3UH5H50MM-NGCJ] 4 GB LPDDR4 mobile DRAM | |
| [* green] Qualcomm [http://www.techinsights.com/technology-intelligence/overview/latest-reports/qualcomm-WTR5975-gigabit-lte-transceiver/|WTR5975|new_window=true] gigabit LTE transceiver | |
| [* light_blue] Qualcomm [https://www.qualcomm.com/news/releases/2017/06/27/qualcomm-delivers-premium-wi-fi-experience-2x2-11ac-wi-fi-technology|WCN3990|new_window=true] 2x2 802.11ac Wi-Fi with MU-MIMO companion | |
| [* blue] Qualcomm WCD9335 audio codec (likely similar to the [https://developer.qualcomm.com/.../wcd9311-audio-codec-device-specification.pdf|WCD9311|new_window=true]) | |
| + | [* violet] 2x Qorvo [link|https://www.qorvo.com/newsroom/news/2017/qorvo-wins-smartphone-designs-with-new-mobile-wi-fi-solutions|QM48859] RF Fusion iFEM module |
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