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Palm Pre Teardown

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Palm Pre Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Palm Pre Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • Logic board with shielding removed

  • Chip markings:

  • Texas Instruments TWL5030B 8CA28MWC

  • Marvell WiFi chip under the silver EMI cover, marked W8686B12. Directly above it is the CSR bluetooth chip. They're both on a daughterboard soldered to the logic board.

  • Samsung SDRAM KMCMG0000M-B998

  • ELPIDA K2132C1PB-60-F 08510N060. Another BGA chip underneath this one is Texas Instruments OMAP3430.

  • Unbranded chips: 3335A ADJ RNX, 89A8 850. And the one hidden with epoxy above Samsung's SDRAM is Kionix 3-Axis Accelerometer.

  • The top of the board is labeled 888-3 94V0 1 309 - F3. The bottom of the board is bereft of chips or markings, something Apple has never done.

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