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BlackBerry Curve 8900 Teardown

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BlackBerry Curve 8900 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • The main IC diagram can be found here.

  • Looking at the datasheets for these ICs, it seems as if everything was built to be as small as possible. Judging from the main PCB and its insanely small size, our guess is that RIM is really looking to make things thinner. The Storm had a similarly sized PCB as well.

  • Cypress Semiconductor continues to win designs for their West Bridge solution, with their CYWB0124AB chip, enabling fast transfer speeds as we earlier noted.

  • MtekVision makes an interesting entrance as well, claiming quite a large space for their camera signal processor. We’re guessing this is what’s responsible for their relatively quick and strong camera captures.

  • Texas Instruments, as always, makes some notable wins with their audio codec, Wi-Fi chipset, and the power management unit.

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