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任天堂 Switch 拆解

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Nintendo Switch Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • A small gathering of Miis ICs populates the front side of the motherboard:

  • NVIDIA ODNX02-A2 (presumably the Tegra X1-based SoC)

  • Samsung K4F6E304HB-MGCH 2 GB LPDDR4 DRAM (x2 for a total of 4 GB)

  • Broadcom/Cypress BCM4356 802.11ac 2×2 + Bluetooth 4.1 SoC

  • Maxim Integrated MAX77621AEWI+T three phase buck regulator (x2)

  • Rohm BM92T36 USB-C controller

  • Texas Instruments BQ24193 single cell battery charger (possibly)

  • Texas Instruments TMP451 remote/local temperature sensor

一小部分的 Miis 安装在主板正面的芯片:

英伟达(NVIDIA) ODNX02-A2 (应为基于Tegra X1的SoC)

三星 (Samsung)K4F6E304HB-MGCH 2 GB LPDDR4 DRAM内存 (两块总计4GB)

博通/赛普拉斯(Broadcom/Cypress) BCM4356 802.11ac 2×2 + 蓝牙 4.1 SoC

美信集成 (Maxim Integrated)MAX77621AEWI+T 三相降压稳压器(x2)

M92T36 630380 电源管理IC

德州仪器BQ24193单电池充电器(可能)

德州仪器TMP451 远程/本地温度传感器

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