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Nintendo Switchの分解

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Nintendo Switch Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • A small gathering of Miis ICs populates the front side of the motherboard:

  • NVIDIA ODNX02-A2 (presumably the Tegra X1-based SoC)

  • Samsung K4F6E304HB-MGCH 2 GB LPDDR4 DRAM (x2 for a total of 4 GB)

  • Broadcom/Cypress BCM4356 802.11ac 2×2 + Bluetooth 4.1 SoC

  • Maxim Integrated MAX77621AEWI+T three phase buck regulator (x2)

  • Rohm BM92T36 USB-C controller

  • Texas Instruments BQ24193 single cell battery charger (possibly)

  • Texas Instruments TMP451 remote/local temperature sensor

チップはマザーボードの表側の小さなスペースに寄せ集められています。

NVIDIA ODNX02-A2 (恐らくTegra X1-based SoC)

Samsung K4F6E304HB-MGCH2 GB LPDDR4 DRAM (2つあり合計4 GB)

Broadcom/Cypress BCM4356 802.11ac 2×2 + Bluetooth 4.1 SoC

Maxim Integrated MAX77621AEWI+Tthree phase buck regulator (x2)

Rohm BM92T36 USB-Cコントローラー

Texas Instruments BQ24193 シングルセルバッテリーチャージャー (おそらく)

Texas Instruments TMP451 リモート/ローカル温度センサー

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