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Teardown de Nintendo Switch

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Nintendo Switch Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • A small gathering of Miis ICs populates the front side of the motherboard:

  • NVIDIA ODNX02-A2 (presumably the Tegra X1-based SoC)

  • Samsung K4F6E304HB-MGCH 2 GB LPDDR4 DRAM (x2 for a total of 4 GB)

  • Broadcom/Cypress BCM4356 802.11ac 2×2 + Bluetooth 4.1 SoC

  • Maxim Integrated MAX77621AEWI+T three phase buck regulator (x2)

  • Rohm BM92T36 USB-C controller

  • Texas Instruments BQ24193 single cell battery charger (possibly)

  • Texas Instruments TMP451 remote/local temperature sensor

Una pequeña colección de circuitos integrados puebla la parte frontal de la placa base:

NVIDIA ODNX02-A2 (presumiblemente el SoC basado en Tegra X1)

DRAM LPDDR4 de 2 GB Samsung K4F6E304HB-MGCH (x2 para un total de 4 GB)

Broadcom / Cypress BCM4356 802.11ac 2 × 2 + Bluetooth 4.1 SoC

Maxim Integrated MAX77621AEWI + T regulador trifásico de inversión (x2)

Controlador Rohm BM92T36 USB-C

Cargador de batería de celda única BQ24193 de Texas Instruments (posiblemente)

Sensor de temperatura local/remoto TMP451 de Texas Instruments

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