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如何焊接和拆焊

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How To Solder and Desolder Connections: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 How To Solder and Desolder Connections: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 How To Solder and Desolder Connections: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • Carefully press a tweezer point or the tip of a spudger on top of the component to hold it in place.

  • The soldering iron will spill a lot of heat around the point of contact, which can easily loosen surrounding components. Be careful not to bump the surrounding parts with your tools.

  • Touch the soldering iron tip to the solder pad and the component. Once the pad heats up, it will draw the molten solder onto itself.

  • This should happen within a few seconds. If the solder doesn't adhere to the pad, apply more flux to the pad or increase the temperature.

  • Don't heat continuously more than 10 seconds at a time, or the heat may damage the component and solder pad. Allow the circuit board to cool down, then try again.

  • Remove the tip from the solder joint.

  • Repeat this process for the rest of the component leads.

小心地将镊子尖头或撬棒尖端按在组件顶部，将其固定到位。

烙铁会在接触点周围散发大量热量，这很容易使周围的元件松动。小心不要用工具碰到周围的部件。

将烙铁头接触焊盘和元件。一旦焊盘加热，它就会将熔化的焊料吸到自身上。

这应该会在几秒钟内发生。如果焊料没有粘附到焊盘上，请在焊盘上涂抹更多助焊剂或提高温度。

每次加热时间不要超过 10 秒，否则热量可能会损坏元件和焊盘。让电路板冷却下来，然后重试。

将尖端从焊点上移开。

对其余元件引线重复此过程。

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