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iPhone 4s 拆解

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iPhone 4S Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 4S Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • Murata SW SS1830010.

  • We suspect that this contains the Broadcom chip that reportedly provides Wi-Fi/Bluetooth connectivity, just like in teardowns past.

  • One more EMI shield comes off and we find another goodie:

  • Toshiba THGVX1G7D2GLA08 16 GB 24 nm MLC NAND flash memory.

村田 SW SS1830010.

我们认为,这包含了Broadcom的芯片,据说提供的Wi-Fi/蓝牙连接的, 过去的拆解中曾出现过。

还有一个EMI屏蔽盖脱落,我们发现另一个礼包:

东芝THGVX1G7D2GLA08 16 GB 24纳米MLC NAND闪存。

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