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Remplacement du ventilateur de la Playstation 3 Super Slim

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PlayStation 3 Super Slim Fan Replacement: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 PlayStation 3 Super Slim Fan Replacement: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 PlayStation 3 Super Slim Fan Replacement: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • Remove the fan wire from its plug on the top metal casing.

  • When removing the wire, do not pull from the wire. Instead, pull from the white plastic male connecter.

  • Remove the motherboard from the top metal casing. Lift from the side with the two USB plugs to avoid damaging the four back ports.

  • There is a thermal compound between the top metal casing and the motherboard in the center, so you may have to apply more force than usual. Do not force the two pieces apart, but slowly apply more and more pressure until the adhesive gives.

  • During reassembly, remember to replace the old thermal compound, as it cannot be reused.

Retirez le fil du ventilateur de sa prise sur le boîtier métallique supérieur.

Lorsque vous retirez le fil, ne tirez pas sur le fil. Tirez plutôt sur le connecteur en plastique blanc.

Retirez la carte mère du boîtier métallique supérieur. Soulevez-la du côté avec les deux prises USB pour éviter d'endommager les quatre ports arrière.

Il y a un adhésif entre le boîtier métallique supérieur et la carte mère au centre, vous devrez donc appliquer plus de force que d'habitude. Ne forcez pas en séparant les deux pièces, mais appliquez une pression augmentant constamment et lentement jusqu'à ce que l'adhésif cède.

[* red] Remove the fan wire from its plug on the top metal casing.
[* icon_caution] When removing the wire, do not pull from the wire. Instead, pull from the white plastic male connecter.
[* black] Remove the motherboard from the top metal casing. Lift from the side with the two USB plugs to avoid damaging the four back ports.
-[* icon_note] There is an adhesive between the top metal casing and the motherboard in the center, so you may have to apply more force than usual. Do not force the two pieces apart, but slowly apply more and more pressure until the adhesive gives.
+[* icon_note] There is a thermal compound between the top metal casing and the motherboard in the center, so you may have to apply more force than usual. Do not force the two pieces apart, but slowly apply more and more pressure until the adhesive gives.
+[* icon_reminder] During reassembly, remember to replace the old thermal compound, as it cannot be reused.

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