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Motorola Droid 3 Teardown

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Motorola Droid 3 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • The main ICs on the front side of the motherboard include:

  • Qualcomm MDM6600 supporting HSPA+ speeds of up to 14.4 Mbps

  • SanDisk SDIN4C2 16GB MLC NAND flash

  • Elpida B4064B2PB-8D-F 512MB RAM and TI OMAP 4430 CPU

  • Triquint TQM7M5013 Linear Power Amplifier

  • Avago A2F1106

  • A5005 K1116, A5002 K1118, A5001 K1118 (from bottom to top)

  • Kionix KXTF9 11425 1411 three-axis accelerometer

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