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iPhone SE の分解

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iPhone SE Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • There's even more silicon goodies on the reverse!

  • Toshiba THGBX5G7D2KLDXG 16 GB NAND Flash

  • 339S00134 (likely an iteration of the Universal Scientific Industrial 339S00043 Wi-Fi module)

  • Apple/Dialog 338S00170 Power Management IC

  • NXP 66V10 NFC Controller and 1610A3 Charging IC (as seen in iPhone 6s/6s Plus)

  • Skyworks SKY77826 Ultra low-band Power Amplifier Duplexer and SKY77357 2G/EDGE Power Amplifier Module (likely an iteration of SKY77336)

  • Apple/Cirrus Logic 338S00105 and 338S1285 Audio ICs (as seen in iPhone 6s/6s Plus)

  • Qualcomm WFR1620 Receive-only Transceiver (as seen in iPhone 6/6 Plus)

反対側にもさらに多くのチップが搭載されています。

Toshiba THGBX5G7D2KLDXG 16 GB NAND フラッシュ

339S00134 (Universal Scientific Industrial 339S00043Wi-Fi moduleの継続シリーズのように見える)

Apple/Dialog 338S00170 パワーマネージメント IC

NXP66V10 NFCコントローラーと1610A3 Charging IC (iPhone 6s/6s Plusと同じ)

Skyworks SKY77826 Ultra low-band パワーアンプデュプレクサとSKY77357 2G/EDGEパワーアンプモジュール(SKY77336)

Apple/Cirrus Logic 338S00105 and 338S1285オーディオIC (iPhone 6s/6s Plusと同じ)

Qualcomm WFR1620Receive-only Transceiver ( iPhone 6/6 Plusと同じ)

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