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任天堂 3DS 拆解

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Nintendo 3DS Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • Chips we've found inside the 3DS motherboard (click here for high-res version):

  • Nintendo 1048 0H ARM CPU

  • Fujitsu MB82M8080-07L 128MB FC-RAM

  • Toshiba THGBM2G3P1FBAI8 2 GB NAND Flash

  • Texas Instruments PAIC3010B 0AA37DW

  • UC CTR 041KM73 KG10

  • Invensense ITG-3270 MEMS Gyroscope

  • ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH

3DS主板上的芯片（点击此处预览高清版本）

任天堂 1048 0H ARM 处理器

富士通 MB82M8080-07L 128MB FC-RAM

东芝 THGBM2G3P1FBAI8 2 GB NAND 闪存

德州仪器 PAIC3010B 0AA37DW

UC CTR 041KM73 KG10

Invensense ITG-3270 MEMS 陀螺仪

ST Micro 2048 33DH X1MAQ 加速度计 型号 LIS331DH

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