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任天堂 3DS 拆解

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Nintendo 3DS Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Nintendo 3DS Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • Moving on, the miniscule IR board can be pried off the board next.

  • Nobody is really certain what the infrared port on the 3DS will do just yet, but we're thinking it's for some 3DS to 3DS line-of-sight communication.

  • The IR controller IC is manufactured by NXP and has the markings:

  • S750 0803 TSD031C

继续拆解,下一步取下IR小板。

目前还不清楚3DS会如何使用红外线通信功能,但是我们猜测3DS会把它用在某种面对面通信之上。

IR控制芯片由NXP制造,上面刻有印记:

S750 0803 TSD031C

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