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Nintendo 3DSの分解手順

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Nintendo 3DS Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Nintendo 3DS Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • Moving on, the miniscule IR board can be pried off the board next.

  • Nobody is really certain what the infrared port on the 3DS will do just yet, but we're thinking it's for some 3DS to 3DS line-of-sight communication.

  • The IR controller IC is manufactured by NXP and has the markings:

  • S750 0803 TSD031C

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