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iPhone 6s Plus 拆解

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iPhone 6s Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • And here's a side of Apple chips on the back of the logic board:

  • SK Hynix H23QDG8UD1ACS 16 GB NAND Flash

  • Universal Scientific Industrial 339S00043 Wi-Fi Module

  • NXP 66V10 NFC Controller (vs. 65V10 found in iPhone 6)

  • Apple/Dialog 338S00122 Power Management IC

  • Apple/Cirrus Logic 338S00105 Audio IC

  • Qualcomm PMD9635 Power Management IC

  • Skyworks SKY77357 Power Amplifier Module (likely an iteration of the SKY77354)

這是邏輯板背面 Apple 芯片的一面:

SK 海力士 H23QDG8UD1ACS 16 GB NAND 閃存

Universal Scientific Industrial 339S00043 Wi-Fi 模塊

NXP 66V10 NFC 控制器(對比 iPhone 6 中的 65V10)

Apple/Dialog 338S00122電源管理IC

Apple/Cirrus Logic 338S00105 音頻 IC

高通PMD9635電源管理IC

Skyworks SKY77357 功率放大器模塊(可能是 SKY77354的迭代)

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