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iPhone 6s Plus 분해도

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iPhone 6s Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • And here's a side of Apple chips on the back of the logic board:

  • SK Hynix H23QDG8UD1ACS 16 GB NAND Flash

  • Universal Scientific Industrial 339S00043 Wi-Fi Module

  • NXP 66V10 NFC Controller (vs. 65V10 found in iPhone 6)

  • Apple/Dialog 338S00122 Power Management IC

  • Apple/Cirrus Logic 338S00105 Audio IC

  • Qualcomm PMD9635 Power Management IC

  • Skyworks SKY77357 Power Amplifier Module (likely an iteration of the SKY77354)

그리고 이 로직 보드 뒷면에 곁들이 Apple 칩이 있습니다:

SK 하이닉스 H23QDG8UD1ACS 16GB NAND 플래시

Universal Scientific Industrial 339S00043 Wi-Fi 모듈

NXP 66V10 NFC 컨트롤러 (vs. iPhone 6의 65V10)

Apple/Dialog 338S00122 전원 관리 IC

Apple/Cirrus Logic 338S00105 오디오 IC

Qualcomm PMD9635 전원 관리 IC

Skyworks SKY77357 전력 증폭기 모듈 (아마도 SKY77354의 신형)

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