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iPhone 6s拆解

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iPhone 6s Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • More ICs on the back of the logic board:

  • Murata 240 Front-End Module

  • RF Micro Devices RF5150 Antenna Switch

  • NXP 1610A3 (likely an iteration of the 1610A1 found in the iPhone 5s and 5c)

  • Apple/Cirrus Logic 338S1285 Audio IC (likely an iteration of the 338S1202 audio codec found in the iPhone 5s)

  • Texas Instruments 65730AOP Power Management IC

  • Qualcomm WTR3925 Radio Frequency Transceiver

  • Possibly a Bosch Sensortec Barometric Pressure Sensor (BMP280)

在逻辑电路板背面的更多芯片:

村田240前端模块

射频微设备RF5150天线开关

NXP 1610A3(在iPhone 5s和5c中发现的可能是迭代的1610A1

苹果/ Cirrus Logic 338S1285音频芯片(在iPhone 5S中发现的可能是迭代338S1202音频编解码器)

德克萨斯仪器65730AOP电源管理芯片

高通 WTR3925射频收发器

可能是博世传感技术公司的气压传感器(BMP280

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