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iPhone 6s 분해도

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iPhone 6s Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6s Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • And now, for the moment we've all been waiting for... It's time to reveal some ICs on the front of the logic board:

  • Apple A9 APL0898 SoC + Samsung 2 GB LPDDR4 RAM (as denoted by the markings K3RG1G10BM-BGCH)

  • Qualcomm MDM9635M LTE Cat. 6 Modem (vs. the MDM9625M found in the iPhone 6)

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo (also found in iPhone 6)

  • Bosch Sensortec 3P7 LA 3-axis Accelerometer (likely BMA280)

  • TriQuint TQF6405 Power Amplifier Module

  • Skyworks SKY77812 Power Amplifier Module

  • Avago AFEM-8030 Power Amplifier Module

드디어, 우리 모두가 리던 시간이 왔습니다... 이제 로직 보드 전면의 몇 몇 IC를 공개할 차례입니다.

Apple A9 APL0898 SoC + Samsung 2GB LPDDR4 RAM (K3RG1G10BM-BGCH 표시)

Qualcomm MDM9635M LTE Cat. 6 모뎀 (vs. iPhone 6의 MDM9625M)

InvenSense MP67B 6-축 자이로스코프 및 가속도계 콤보 (iPhone 6에도 있음)

Bosch Sensortec 3P7 LA 3-축 가속도계 (BMA280 가능)

TriQuint TQF6405 전력 증폭기 모듈

Skyworks SKY77812 전력 증폭기 모듈

Avago AFEM-8030 전력 증폭기 모듈

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