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iPhone4 Verizon拆解

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iPhone 4 Verizon Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • The back side of the Verizon logic board (on top) contains:

  • Qualcomm MDM6600

  • Toshiba TH58NVG7D2FLA89 16 GB NAND Flash

  • Toshiba Y890A111222KA

  • RS KMOD16104 - The logo on this package appears to be that of Murata's. We suspect that this contains the Broadcom BCM4329 that reportedly provides Wi-Fi/Bluetooth connectivity.

  • Adding credibility to this statement is the fact that we found this chip last June in the GSM iPhone 4 and that Murata and Broadcom have had RF partnerships in the past.

Verizon主板（在上面）背面包含了：

高通MDM6600

东芝TH58NVG7D2FLA89 16 GB NAND Flash

东芝Y890A111222KA

RS KMOD16104-封装表面的标识似乎是村田的，我们怀疑这包含据报道提供Wi-Fi/蓝牙连接的博通BCM4329。

为这一声明增加可信度的是，在去年6月我们拆解iPhone4 GSM的时候发现了这块芯片，博通和村田曾经有射频合作

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