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任天堂 3DS XL 2015 拆解

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  • The back of the motherboard has a few goodies as well.

  • Texas Instruments AIC3010D 48C01JW (Possibly Codec IC)

  • NXP S750 1603 TSD438C Infrared IC

  • Texas Instruments PH416A I/O Expander

主板背面也有少量芯片。

德州仪器 AIC3010D 48C01JW (可能是音频解码 IC)

NXP S750 1603 TSD438C 红外 IC

德州仪器 PH416A 输入输出扩展。

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