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Demontage van de iPhone 6 Plus

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  • Back of the logic board.

  • SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash

  • Murata 339S0228 Wi-Fi Module

  • Apple/Dialog 338S1251-AZ Power Management IC

  • Broadcom BCM5976 Touchscreen Controller

  • NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)

  • NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)

  • Qualcomm WTR1625L RF Transceiver

Achterkant van de printplaat.

SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash

Murata 339S0228 WiFi Module

Apple/Dialog 338S1251-AZ Power management IC

Broadcom BCM5976 touchscreen controller

NXP LPC18B1UK ARM Cortex-M3 Microcontrollers (ook gekend als M8 Bewegingscoprocessor)

NXP 65V10 NFC module + beveiligingselement (bevat hoogstwaarschijnlijk een NXP PN544 NFC controller)

Qualcomm WTR1625L RF Transceiver

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