crwdns2933423:0crwdne2933423:0

Nintendo DSi XL Teardown

crwdns2936315:0crwdne2936315:0
crwdns2936325:0crwdne2936325:0
crwdns2931653:020crwdne2931653:0
Nintendo DSi XL Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Nintendo DSi XL Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • Samsung and Fujitsu chips are identical to the DSi:

  • Samsung 1st generation MoviNAND KMAPF0000M: 256 MB NAND Flash and MMC controller. The integrated MMC controller allows the CPU to offload the complex work of directly talking to the flash memory.

  • 82DBS08164D-70L: Fujitsu Ltd 128-bit FCRAM (fast-cycle RAM) chip.

  • TI (TXN) 72071B0 power managing and charging circuit. This used to be a Mitsumi chip in the smaller DSi.

  • PAIC3005B: We assume it stands for Primary Antenna Interface Controller, given that it's located right by the antenna.

  • Primary Nintendo ARM CPU, manufactured the last week of 2009. This chip's markings are identical to the DSi. It's definitely not the Tegra chip that had been rumored.

crwdns2935429:0crwdne2935429:0

crwdns2935429:0crwdne2935429:0

crwdns2935429:0crwdne2935429:0

crwdns2935429:0crwdne2935429:0

crwdns2935429:0crwdne2935429:0

crwdns2935429:0crwdne2935429:0

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0