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Desmontaje de Mac Pro a finales de 2013

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Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Let's identify the ICs on the rear of the logic board:

  • LGA 2011 (Socket R) CPU socket

  • Microchip EMC1428 8-Channel Temperature Sensor Monitor

  • International Rectifier IR3575 Synchronous Buck Gate Driver with integrated MOSFET and Schottky diode

  • NXP PA9517A Level Translating I2C-Bus Repeater

  • Texas Instruments 58872D

  • The front side of the logic board:

  • Intersil ISL 6367 Hybrid Digital Dual PWM Controller

Identifiquemos los circuitos integrados en la parte posterior de la placa lógica:

Zócalo de la CPU LGA 2011 (Socket R)

Microchip EMC1428 Monitor de temperatura del sensor de 8 canales

Controlador de compuerta sincrónica International Rectifier IR3575 con diodos Schottky y MOSFET integrados

NXP PA9517A Nivel que traduce el repetidor I2C-Bus

exas Instruments 58872D

La parte frontal de la placa lógica:

Controlador híbrido dual digital PWM Intersil ISL 6367

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