crwdns2933423:0crwdne2933423:0

iPhone 15 Pro Max 칩셋 식별

crwdns2935443:0crwdne2935443:0

= crwdns2915112:0crwdne2915112:0 = crwdns2861241:0crwdne2861241:0
crwdns2936315:0crwdne2936315:0
crwdns2936325:0crwdne2936325:0
    ***These board shots are taken using a US iPhone 15 Pro Max.*** This model lacks a physical SIM tray, but contains hardware to support 5G mmWave bands, as well as satellite communication.
    Check out our [link|https://www.ifixit.com/News/82867/iphone-15-teardown-reveals-software-lockdown|iPhone 15 teardown|new_window=true] for more details.
    ''Special thanks to our community member [link|https://www.ifixit.com/User/3536909/CChin|Chunglin Chin] for contributing to this!''
    [video|https://www.youtube.com/watch?v=hmQHgWNAg24]

    crwdns2931349:0crwdne2931349:0

    crwdns2936071:01crwdne2936071:0 — Main PCB 1면

    (추정) Kioxia K5A4RB6302CA12304 256 GB NAND 플래시 메모리

    crwdns2936071:02crwdne2936071:0 — Main PCB 1면 - 연결성

    (추정) NXP Semiconductor NFC 컨트롤러

    crwdns2936071:03crwdne2936071:0 — Main PCB 2면

    Apple APL1V02/339S01257 A17 Pro 6-core 중앙처리장치 & (추정) SK hynix H58G66AK6HX132 8 GB LPDDR5 SDRAM RAM 아래에 위치한 6-core GPU

    crwdns2936071:04crwdne2936071:0

    Broadcom BCM59365EA1IUBG 무선 전원 수신 관리 칩셋

    crwdns2936071:05crwdne2936071:0 — Main PCB 2면 - 연결성

    (추정) Apple 339M00298 UWB(초광대역) 모듈

    crwdns2936071:06crwdne2936071:0 — Main PCB 2면 - 센서

    Bosch Sensortec 6-축 MEMS 가속도계 & 자이로스코프

    crwdns2936071:07crwdne2936071:0 — 무선 통신 보드 1면

    STMicroelectronics ST33J 보안 마이크로컨트롤러

    crwdns2936071:08crwdne2936071:0 — 무선 통신 보드 1면 - 연결성

    Qualcomm SDX70M Snapdragon X70 모뎀

    crwdns2936071:09crwdne2936071:0

    (추정) Skyworks SKY50313 프론트-엔드 모듈

    crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0