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Sony's PlayStation VR2の分解

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Sony's PlayStation VR2 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 Sony's PlayStation VR2 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 Sony's PlayStation VR2 Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • Heatsink can now be removed. This reveals the IC Chip for the headset.

  • Sony refers to the thermal conduction material as TIM, however the name is a shortening of Thermal Interface Material, which is actually a category of material that's inserted between the two components, and not the material itself. Best guess is that the material itself is a type of non-adhesive thermal glue.

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