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iPhone 14 Pro Max 芯片信息

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iPhone 14 Pro Max Chip ID, Underside of the top-most layer: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 14 Pro Max Chip ID, Underside of the top-most layer: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
Underside of the top-most layer

  • Chip ID part 1:

  • Apple APL1W10/339S01104 A16 64-bit hexa-core applications processor w/ penta-core GPU layered underneath most likely Samsung K3LK2K20CM-EGCP 6 GB LPDDR5 SDRAM memory

  • Apple APL109A/338S00942 power management

  • Apple/Dialog Semiconductor 338S00839-B0 power management

  • Broadcom BCM59365EA1IUBG wireless power receiver

  • STMicroelectronics STB601A05 power management

  • Apple/Dialog Semiconductor 338S00819-A1 power management

  • Texas Instruments TPS65657B0 display power supply

上层主板背面

芯片信息第一部分：

极有可能是三星K3LK2K20CM-EGCP 6 GB LPDDR5 SDRAM 内存和它下方封装的64-bit 6 核中央处理器，5 核图形处理器Apple APL1W10/339S01104 A16芯片

Apple APL109A/338S00942 电源管理

Apple/Dialog Semiconductor 338S00839-B0 电源管理

博通 BCM59365EA1IUBG 无线充电接收器

意法半导体 STB601A05 电源管理

Apple/Dialog Semiconductor 338S00819-A1 电源管理

德州仪器 TPS65657B0 显示屏供电

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