crwdns2935425:03crwdne2935425:0
crwdns2931653:03crwdne2931653:0
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Remove the logic board with Heating Platform at 170 °C.
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Because the phone has been heavily dropped before, we can see that there are many missing pads on the bonding pads.
crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0