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iPhone 13 Pro Motherboard Separation

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iPhone 13 Pro Motherboard Separation: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone 13 Pro Motherboard Separation: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone 13 Pro Motherboard Separation: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • For better heat dissipation, both sides of the motherboard are covered with thick heat dissipation tape.

  • Then we remove foam on the motherboard. Remove tape on the motherboard with Hot Air Gun at 100 °C. It can be seen that NAND is under the A15 tape.

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